Vujosevic, Milena: search on Z-Library

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1

Critical state of a two-dimensional elastic continuum containing elliptical voids

Kaushik Mallick, Dusan Krajcinovic, Dragoslav Sumarac, Milena Vujosevic

Journal:

Engineering Fracture Mechanics

Year:

1993

Language:

english

File:

PDF, 1.42 MB

english, 1993

2

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Warpage of Flip Chip BGA Package

Vujosevic, Milena

Year:

2006

Language:

english

File:

PDF, 509 KB

english, 2006

3

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study

Tripathi, Shantanu, Han, Ru, Vujosevic, Milena

Year:

2016

Language:

english

File:

PDF, 463 KB

english, 2016

4

Creep rupture of polymers-a statistical model

Milena Vujosevic, Dusan Krajcinovic

Journal:

International Journal of Solids and Structures

Year:

1997

Language:

english

File:

PDF, 1.04 MB

english, 1997

5

Strain localization-short to long correlation length transition

Dusan Krajcinovic, Milena Vujosevic

Journal:

International Journal of Solids and Structures

Year:

1998

Language:

english

File:

PDF, 1.84 MB

english, 1998

6

Brittle to Quasi-Brittle Transition

Dusan Krajcinovic, Sreten Mastilovic, Milena Vujosevic

Journal:

Year:

1998

Language:

english

File:

PDF, 453 KB

english, 1998

7

Software verification and graph similarity for automated evaluation of students’ assignments

Vujošević-Janičić, Milena, Nikolić, Mladen, Tošić, Dušan, Kuncak, Viktor

Journal:

Information and Software Technology

Year:

2013

Language:

english

File:

PDF, 614 KB

english, 2013

8

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Temperature cycling performance of ball grid array packages under thermal enabling load

Arakere, Guruprasad, Vujosevic, Milena, Cook, Jeffrey

Year:

2014

Language:

english

File:

PDF, 966 KB

english, 2014

9

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load

Ge, Yun, Cook, Jeffrey, Pei, Min, Vujosevic, Milena, Zhou, Bite, Nad, Suddhasattwa

Year:

2014

Language:

english

File:

PDF, 3.39 MB

english, 2014

10

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Accessing adhesive induced risk for BGAs in temperature cycling

Arakere, Guruprasad, Vujosevic, Milena, Pei, Min

Year:

2014

Language:

english

File:

PDF, 864 KB

english, 2014

11

Comparison of vasorelaxant effect and tolerance profile of a novel isosorbide-5-mononitrate derivative with its stereoisomer and parent drug on rat mesenteric artery

Stepanović-Petrović, Radica, Savić, Vladimir, Tomić, Maja, Tokic-Vujošević, Zorana, Simić, Milena, Stepanović, Jelena, Jokanović, Milan, Micov, Ana

Journal:

Arzneimittelforschung

Year:

2011

Language:

english

File:

PDF, 322 KB

english, 2011

12

A Comparative Analysis of Value at Risk Measurement on Emerging Stock Markets: Case of Montenegro

Cerović, Julija, Lipovina-Božović, Milena, Vujošević, Saša

Journal:

Business Systems Research Journal

Year:

2015

Language:

english

File:

PDF, 922 KB

english, 2015

13

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Board level interconnect risk assessment in spherical bend

Arakere, Guruprasad, Vujosevic, Milena, Embree, Todd

Year:

2016

Language:

english

File:

PDF, 865 KB

english, 2016

14

Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components

SUHIR, Ephraim, VUJOSEVIC, Milena

Journal:

Journal of Solid Mechanics and Materials Engineering

Year:

2010

Language:

english

File:

PDF, 399 KB

english, 2010

15

[IEEE 2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm) - Clearwater Beach, FL, USA (2016.10.9-2016.10.12)] 2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm) - Predicting vibration-induced fretting in land grid array sockets in simulated field scenarios

Meyyappan, Karumbu, Wu, QiFeng, Vasudevan, Vasu, Vujosevic, Milena

Year:

2016

File:

PDF, 657 KB

2016

16

GARCH models in value at risk estimation: empirical evidence from the Montenegrin stock exchange

Smolović, Julija Cerović, Lipovina-Božović, Milena, Vujošević, Saša

Journal:

Economic Research-Ekonomska Istraživanja

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

17

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Pei, Min, Arakere, Guru, Vujosevic, Milena

Year:

2017

Language:

english

File:

PDF, 1.54 MB

english, 2017

18

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification

Pei, Min, Vujosevic, Milena, Mukherjee, Sibasish

Year:

2017

Language:

english

File:

PDF, 1.59 MB

english, 2017

19

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Meyyappan, Karumbu, Vujosevic, Milena, Wu, Qifeng, Malatkar, Pramod, Hill, Charles, Parrott, Ryan

Year:

2017

Language:

english

File:

PDF, 2.40 MB

english, 2017

20

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics

Rahmani, Helia, Vujosevic, Milena, Pei, Min

Year:

2015

Language:

english

File:

PDF, 2.63 MB

english, 2015

21

Knowledge based qualification process to evaluate vibration induced failures in Electronic Components

Meyyappan, Karumbu, Vujosevic, Milena, Wu, Qifeng, Malatkar, Pramod, Hill, Charles, Parrott, Ryan

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 2.46 MB

english, 2018

22

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Use Condition Risk Assessment for Moisture Related Failures

Pei, Min, Mukherjee, Sibasish, Uppal, Nitin, Vujosevic, Milena

Year:

2017

Language:

english

File:

PDF, 670 KB

english, 2017

23

[IEEE 2017 IEEE Holm Conference on Electrical Contacts - Denver, CO, USA (2017.9.10-2017.9.13)] 2017 IEEE Holm Conference on Electrical Contacts - Reliability test induced failures vs field performance: Contact fretting perspective

Meyyappan, Karumbu, Wu, Qifeng, Vujosevic, Milena, Hill, Charles, Parrott, Ryan

Year:

2017

File:

PDF, 869 KB

2017

24

SAE Technical Paper Series [SAE International International Congress & Exposition - (MAR. 01, 1999)] SAE Technical Paper Series - Stress Isolation of an Accelerometer Die in a Post-molded Plastic Package - The Impact of Die Coat Coverage

Vujosevic, Milena, Shah, Mahesh

Year:

1999

Language:

english

File:

PDF, 537 KB

english, 1999

25

The learnability of the dimensional view of data and what to do with it

Vujošević, Dušan, Kovačević, Ivana, Vujošević-Janičić, Milena

Journal:

Aslib Journal of Information Management

Year:

2018

Language:

english

File:

PDF, 326 KB

english, 2018

26

[IEEE 2020 Zooming Innovation in Consumer Technologies Conference (ZINC) - Novi Sad, Serbia (2020.5.26-2020.5.27)] 2020 Zooming Innovation in Consumer Technologies Conference (ZINC) - SpeCS â SPARQL Query Containment Solver

Spasic, Mirko, Janicic, Milena Vujosevic

Year:

2020

File:

PDF, 294 KB

2020